Yantai smt chip processing, SMT chip processing technology is a packaging technology in electronic products, which allows electronic components to be mounted on the surface of a printed circuit board (PCB / PWB), rather than through a circuit board Holes to insert them.

The history of SMT originated from flat package (FP) and hybrid technology in the 1950s and 1960s. But in fact, today's Yantai SMT patch can be regarded as an evolving technology. At present, the application of fine pitch, ultra fine pitch (UFP) and ball grid array (BGA) is becoming more and more common.

Even more advanced placement technologies, such as chip-on-board (COB), automated tape bonding (TAB), and flip-chip technology, have also been widely recognized. Using wire bonding, tabs or flip-chip multi-chip modules (MCM) can achieve the highest possible performance, but at a higher cost.